Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
Humidity Robustness of Electronics: How to Tackle? NEW! Rajan Ambat, Technical University of Denmark Sunday, September 22 | 8:30am — 12:00pm Proposed course aims to development a broader understanding on the humidity robustness issues and contributing factors, and how pro-active design, process control, and other protective measures
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
• Solder paste exposed beyond worklife • Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes
| https://www.wesource.com/batch-ovens-and-chambers/tenney-tujr-temperature-test-chamber-id-140490-5/22/
±0.3ºC - Hermetic refrigeration system - Low mass nichrome, open wire heating system - NEC wiring compliance - Vertical-down recirculating conditioning system - Double silicon gaskets on doors - 2 diameter
Heller Industries Inc. | https://hellerindustries.com/nonwetting/
worklife Ambient humidity and temperature beyond paste work envelope A palladium lead finish which requires higher reflow (liquidus) temperature Reflow-related causes of PCB Nonwetting: Peak reflow (liquidus
Heller Industries Inc. | https://hellerindustries.com/dewetting/
worklife Ambient humidity and temperature beyond paste work envelope A palladium lead finish which requires higher reflow (liquidus) temperature Reflow-related causes: Peak reflow (liquidus
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/about-us/corporate-headquarters
. Nordson Headquarters project features: - Bike racks have been installed - Building is located on public bus route - Showers are provided for bicycling commuters - Preferred parking spaces are provided for carpoolers and low emitting
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
beyond worklife Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes of solder ball defects: Too rapid heating, particularly in preheat resulting in splattering. Keep below 4K/sec. per any 20 sec
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
beyond worklife Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes of solder ball defects: Too rapid heating, particularly in preheat resulting in splattering. Keep below 4K/sec. per any 20 sec
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
beyond worklife Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes of solder ball defects: Too rapid heating, particularly in preheat resulting in splattering. Keep below 4K/sec. per any 20 sec
| https://www.smtfactory.com/electrostatic-discharge-ESD.html
. Environmental conditions such as low humidity also increase the likelihood of ESD events. How Does Electrostatic Discharge Affect Electronic Components
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