PCB Libraries, Inc. | https://www.pcblibraries.com/forum/solder-paste-for-th-component_topic179.html
Solder paste for TH component - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Solder paste for TH component
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic179&OB=DESC.html
Solder paste for TH component - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Solder paste for TH component
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
;We use the IPC-7351 mathematical model that is illustrated in IPC-7351B.See the Surface Mount References Calculator for the math formula. 
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10535.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2587&OB=DESC.html
. The Solder Joint Goals are in addition to the Manufacturing Tolerances and the Component Package and Terminal Lead Min./Max. Tolerances. We use the IPC-7351 mathematical model that is illustrated in IPC-7351B
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2587&OB=ASC.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_footprints-land-patterns_forum5.xml
: Tom HSubject: Definitions of Toe/Heel/CourtyardPosted: 27 Jul 2020 at 8:39amThe proper footprint for every surface mount package is derived from the IPC-7351 mathematical model.