| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
) when in Rev E of J-STD-001 it was a process indicator (P2D3)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/china-fab-quote/
0.025" SMD Pads Smallest Hole less than 0.010" 0.010" 0.011" 0.012" 0.013" 0.014" 0.015" over 0.015" Approximate Holes * Mask Sides None Top Side Bottom Side Both Sides Mask Color Other Green Black White Blue Red Mask Finish Glossy Matte Silkscreen Sides None Top Side Bottom Side Both Sides Silkscreen Color Other White
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
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