ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=2
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=7
axis either until the bond breaks (destructive testing) or a pre-defined force is reached (non-destructive testing). Wire bond testing is covered by the external standard MIL-STD-883 (Methods
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=6
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/wire-pull?page=3
) oder eine vordefinierte Kraft erreicht wird (zerstörungsfreie Prüfung). Drahtbondtests werden durch den externen Standard MIL-STD-883 abgedeckt (Methoden 2011.7 für
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/die-shear?con=t&page=6
über dem Substrat aus. Die Prüfung ist ähnlich wie bei Standard-Kugelschertests und wird in Übereinstimmung mit MIL STD 883 durchgeführt. Platinen-Scherprüfungen mit niedrigem Profil sind erforderlich, wenn die zu
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/die-shear?con=t&page=7
über dem Substrat aus. Die Prüfung ist ähnlich wie bei Standard-Kugelschertests und wird in Übereinstimmung mit MIL STD 883 durchgeführt. Platinen-Scherprüfungen mit niedrigem Profil sind erforderlich, wenn die zu
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=1
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=4
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=5
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wire-pull?con=t&page=1
axis either until the bond breaks (destructive testing) or a pre-defined force is reached (non-destructive testing). Wire bond testing is covered by the external standard MIL-STD-883 (Methods
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