| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types-2020/connectors
, Lebensdauerprüfungen und einzelne Pins können mit einer einzigen Maschine untersucht werden. Es können Kräfte von wenigen Gramm (mN) bis 100 kg (1000 N) aufgebracht werden. Steckverbinder haben aufgrund von
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/connectors
, HDMI and Ethernet to be tested. Insertion forces, lifetime testing and individual pins can be investigated using a sinle machine. Forces from a few grams (mN) to 100 kg (1000 N) can be applied
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
note that high temperature results in much faster oxidation. In high-temperature zone, oxidation speed may increase in a linear way
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
note that high temperature results in much faster oxidation. In high-temperature zone, oxidation speed may increase in a linear way
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
note that high temperature results in much faster oxidation. In high-temperature zone, oxidation speed may increase in a linear way
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
solder on both sides of the component melts and adheres to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
solder on both sides of the component melts and adheres to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
solder on both sides of the component melts and adheres to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control
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