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. Goetz and Marc Papageorge, ASAT, Inc. "BGA Performance, Characteristics: A User’s Design Guide" 1994: Andrew J. Mawer, Motorola Semiconductor Division "Plastic Ball Grid Array Solder Joint Reliability Considerations" 1993: Dr. Ning-Cheng Lee, Dr
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(Ball Grid Array) solder crack problem in late 1990s, PCB/Components warpage and High-Density PCB/Substrate reliability issues in the 2000s
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containing various combinations of solid solution and dispersion strengthening agents. Daisy chained ball grid array (BGA) test vehicles were fabricated with SAC305 as a baseline and three different developmental alloys each employing significant additions of various combinations of antimony (Sb), indium (In), and bismuth (Bi
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