Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
provides a depth-adjustable image of the interfaces—showing voids, delamination and other interfacial defects. In fig. 5, the solder preform has melted and balled up before wetting: the negative (“smiley”) substrate deflection amounted to about 50% of the
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
| 1 |
