361 no clean cleanliness requirements results

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals

: I know for tinning stranded wires you should not use Type H or M flux, so we are ordering a No-clean solder Sn63Pb37 with a flux designator ROL0

(How to figure out what works and what doesn’t!) Stewart McCracken, MCS No-Clean Solder Paste in Automotive Electronics – Enhanced Electrical Reliability for High-Power Components

40731 | https://www.smta.org/harsh/Harsh-Environments-Program-2019.pdf?v=20052905555

Surface Mount Technology Association (SMTA)

40731

(How to figure out what works and what doesn’t!) Stewart McCracken, MCS No-Clean Solder Paste in Automotive Electronics – Enhanced Electrical Reliability for High-Power Components

40731 | https://www.smta.org/harsh/Harsh-Environments-Program-2019.pdf?v=20061608642

Surface Mount Technology Association (SMTA)

40731

IPC-6012 Instructor Certification - Online Program | EPTAC

| https://www.eptac.com/etrainings/ipc-6012-instructor-certification-online/

Requirements Visual Requirements Day 2 Visual Requirements (continued) Dimensional and Conductor Requirements Structural Integrity Solder Mask, Electrical, Cleanliness, Rework and Repair Day 3 Special Requirements Quality Assurance Provisions and Notes Supplemental

Soldering Covers to a Housing - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/soldering-covers-to-a-housing/

. If the residues can be shown to be no-clean, and that information should be available from the supplier, then this should be sufficient to meet the requirements of the document

SolderTips: Defining Shear Forces for Surface Mounted Components - EPTAC - Train. Work Smarter. Succ

| https://www.eptac.com/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components/

: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question

 Organic flux activity level L1 shall not be used for no-clean soldering. 3 9 J-STD-001 D 3.3 Flux  When other activity levels or flux materials are used, compatibility data shall be available for review. 3

| https://www.eptac.com/wp-content/uploads/2007/09/webinar_eptac_09_19_07-2.pdf

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs/

: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40

SolderTip #41: J-STD-001 Revision E is Here - Order it Now! - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-41-j-std-001-revision-e-is-here-order-it-now/

: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39

SolderTip #44: IPC Guidelines for Flux Selection and Use - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-44-ipc-guidelines-for-flux-selection-and-use/

: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question