| https://pcbasupplies.com/wp-content/uploads/2023/05/MSDS-BC-10.pdf
. Do not rub or close eyes. Remove foreign matter, rinse the eyes with running water and immediately seek medicial attention. Vomit the ingested material, seek medical attention
| https://www.eptac.com/faqs/ask-helena-leo/page/4
... Read More Soldering Stranded Wire QUESTION Question: Once a wire is pre-tinned with lead free – no clean solder, can it then be considered solid wire and then be soldered to a PCBA using water soluble flux
| http://etasmt.com/cc?ID=te_news_bulletin,18961&url=_print
. The water-soluble flux and no-clean flux will have the same cleaning action, but the temperature is slightly different. Remove metal oxides and certain contamination from the metal and solder particles to be bonded. 3
| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print
. The flux is active and the chemical cleaning action starts. The water-soluble flux and no-clean flux will have the same cleaning action, but the temperature is slightly different
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. IPC classification is ROL0. R residue is hard, non-corrosive, non-conductive, and may be left on. Residue may be removed with an appropriate solvent. No clean (N
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. IPC classification is ROL0. R residue is hard, non-corrosive, non-conductive, and may be left on. Residue may be removed with an appropriate solvent. No clean (N
| http://etasmt.com:9060/te_news_bulletin/2020-09-19/19361.chtml
. The flux is active and the chemical cleaning action starts. The water-soluble flux and no-clean flux will have the same cleaning action, but the temperature is slightly different
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
