| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. As stated in a article by Eric Bastow of Indium Corporation: Intermetallics in Soldering “Keep in mind that dissolution, the phenomenon of a solid dissolving into a liquid, is affected by both time and temperature
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Leadfree PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 1 of 24 Rev Level: 1 Rev Date: 1/03/01 A Practical Investigation Into the Use of No Lead Solders for SMT Reflow Heller Industries and Soldering Technology David Heller and Jim Raby Project Title
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Leadfree PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 1 of 24 Rev Level: 1 Rev Date: 1/03/01 A Practical Investigation Into the Use of No Lead Solders for SMT Reflow Heller Industries and Soldering Technology David Heller and Jim Raby Project Title
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. With a higher reflow temperature and a longer TAL, more substrate metallization is dissolved and more intermetallics are formed (Arra, 2002). Solder joint strength may be affected by both lack of intermetallic formation as well as excess intermetallics
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. With a higher reflow temperature and a longer TAL, more substrate metallization is dissolved and more intermetallics are formed (Arra, 2002). Solder joint strength may be affected by both lack of intermetallic formation as well as excess intermetallics
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
] Devices manufactured at and below the 7nm node are no longer achieving the same energy efficiencies of scale as older nodes [4] and are therefore driving the increasing overall heat flux [Fig. 2]. D.W
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