PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
. Is that true anymore? I see 0.10mm courtyard excess in the goal tables and I'd like to roll with it, but wanted to understand if that was discouraged Best, -Matt stanleycayochok Members Profile Send Private Message Find Members
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
. Is that true anymore? I see 0.10mm courtyard excess in the goal tables and I'd like to roll with it, but wanted to understand if that was discouraged Best, -Matt stanleycayochok Members Profile Send Private Message Find Members
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html
. Is that true anymore? I see 0.10mm courtyard excess in the goal tables and I'd like to roll with it, but wanted to understand if that was discouraged Best, -Matt stanleycayochok Members Profile Send Private Message Find Members
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post12079.html
. Is that true anymore? I see 0.10mm courtyard excess in the goal tables and I'd like to roll with it, but wanted to understand if that was discouraged Best, -Matt stanleycayochok Members Profile Send Private Message Find Members
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11251.html
. Land pattern footprint pad sizes and locations play a significant role in meeting these requirements. The IPC-7351 guideline falls under J-STD-001 to define the solder joint goals for Toe, Heel and Side values and the land pattern and pad stack naming conventions
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post10536.html
. Land pattern footprint pad sizes and locations play a significant role in meeting these requirements. The IPC-7351 guideline falls under J-STD-001 to define the solder joint goals for Toe, Heel and Side values and the land pattern and pad stack naming conventions
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2588&OB=ASC.html
. Land pattern footprint pad sizes and locations play a significant role in meeting these requirements. The IPC-7351 guideline falls under J-STD-001 to define the solder joint goals for Toe, Heel and Side values and the land pattern and pad stack naming conventions
| https://pcbasupplies.com/leaded-solder-wire/
. Contact CustomerService@PCBASupplies.com with questions. Category: Flux Cored Solder Wire Brand: Koki Solder Description Excellent solderability, very fast wetting High surface insulation resistance and non-corrosive, cleaning may be eliminated Very little spitting of solder, very low fume
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
. This is data, not anecdotal evidence, so we should pay attention. Voids are truly a phenomenon in liquid physics, where you have two liquids, molten solder and some other non-metallic liquid, such as flux and carrying vehicles
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=16
& Support About Nordson DAGE Company Profile ISO 9000 Certification News Events ThinkTank Awards Terms and Conditions of Sale Purchasing Terms and Conditions Patents Modern Slavery Act Statement WEEE
