GPD Global | https://www.gpd-global.com/fluid-dispense-adhesive-application.php
; typically ceramic, gold, and FR4 substrates. It makes the electrical and adhesive connection between device and electrical pad and substrate
GPD Global | https://www.gpd-global.com/dispensing-conductive-adhesive.php
; typically ceramic, gold, and FR4 substrates. It makes the electrical and adhesive connection between device and electrical pad and substrate
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
| https://www.eptac.com/faqs/ask-helena-leo/ask/pem-nut-soldering-criteria
. The base of the PEM ® nut should be on a non functional land/pad area on the PCB board to which it can be soldered and the securing hardware should originate on the opposite side of the PCB board
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. The possible causes include too short contact time or low soldering temperature. This is evident by poor wetting, a non-smooth surface, and/or a chalky or grainy appearance
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/
. Non Wetting Or De Wetting Non-wetting is an SMT defect that occurs when the base metal surface on the board doesn’t accept the molten solder, creating a poor joint condition where a component’s terminals
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
