| https://www.eptac.com/webinars/delamination-causes-and-cures
. So how do you address these issues? Learn how this occurs in the production and assembly process, how to deal with it and understand the difference between true delamination and other forms of separation such as measling, haloing and crazing
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Transport-Wheel-Tensioning-817-1-4_DOC.pdf
. Transport wheel tension should be rechecked monthly or if inconsistent forming occurs. We recommend using a dial indicator during the following procedure
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Transport-Wheel-Tensioning-817-1-4_DOC.pdf
. Transport wheel tension should be rechecked monthly or if inconsistent forming occurs. We recommend using a dial indicator during the following procedure
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
. Interference often occurs when electronic components are too close together, powered from the same source, or in range of a high-power transmitter producing radio waves
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_is-pcb-repair-a-beneficial-than-buying-new-pcb_topic2121.xml
. Thecommon faults that occurs are burn-outs, blown tracks and failedcomponents. Does repairing PCB's save you money and is beneficial
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. What is a Solder Bridge? Solder bridging is a common defect that occurs during the SMT assembly process. A solder bridge occurs when an unintended connection of solder has been formed between two traces, pads, or pins, forming a conductive path
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/
. A lamination void is a printed circuit board defect that occurs when the bond between prepreg and the copper foil is weak. Prepreg is the adhesive that bonds the core and layers of a PCB together
| https://www.eptac.com/soldertip/smt-component-shifting/
. The shifting is not limited to a single component, but rather changes daily, where the component shifting occurs and moves from one location to another very randomly
| https://www.eptac.com/faqs/soldertips/soldertip/smt-component-shifting
. The shifting is not limited to a single component, but rather changes daily, where the component shifting occurs and moves from one location to another very randomly. Question
| https://www.eptac.com/5-common-solder-mistakes-and-how-to-resolve-them/
. Disturbed Joint A disturbed joint typically occurs as a result of movement while the alloy is solidifying. The resulting joint will appear to be rough or frosted and display a ripple pattern on the joint surface
