GPD Global | https://www.gpd-global.com/co_website/features-needlecleaner.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
GPD Global | https://www.gpd-global.com/features-needlecleaner-max.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
GPD Global | https://www.gpd-global.com/features-needlecleaner.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
GPD Global | https://www.gpd-global.com/fluid-dispenser-nozzle.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
GPD Global | https://www.gpd-global.com/fluid-dispensing-nozzle.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
GPD Global | https://www.gpd-global.com/features-needlecleaner-max2.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
GPD Global | https://www.gpd-global.com/fluid-dispense-nozzle-clean.php
. The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Component Contamination Board Contamination Pad Size Mismatch Cause Open Joint DEFECT Tombstoning Voids Solder Wicking Non-Wetting Incomplete Fillets Poor Strength Solder Shorts Solder Balls
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-component-tombstone-on-flex-circuit
: Can you tell me if there are other reasons that components tombstone? We have looked at the pad size and the amount of paste on the pads
