| https://www.smtfactory.com/I-C-T-2022-Sales-Competition-and-We-Peak-a-Historical-High-Monthly-Sales-id41393777.html
I.C.T 2022 Sales Competition and We Peak a Historical High Monthly Sales - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/cc?ID=te_news_bulletin,15961&url=_print
. The peak temperature is generally determined by the melting temperature of the solder paste and the heat resistance temperature of the PCB substrate and components
| http://etasmt.com/cc?ID=te_news_bulletin,21161&url=_print
. In the reflow section, the peak soldering temperature varies depending on the solder paste used. Generally, the melting point temperature of the solder paste plus 20-40°C is recommended
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C
| http://etasmt.com/cc?ID=te_news_bulletin,23573&url=_print
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
• Improper application of solder mask • Excessive slump of solder paste Reflow-related causes: • Improper reflow profile for solder paste
.gif)
winsouce.jpg)