PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/UserGuide/download/Footprint%20Expert%20Surface%20Mount%20Families.pdf
/downloads http://www.PCBLibraries.com/forum updated 5‐20‐22 Note: The Land Pattern images are shown in the Nominal Density Level Non‐polarized Rectangular Chip Components Chip Capacitor Chip Resistor Chip Inductor Chip Varistor
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1894&OB=ASC.html
” button to match the Calculator UI Added a Sample Part Help: Updated the IPC-7351B and C Land Pattern Naming Convention documents Updated the
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/different-tolerances_topic1618_post6614.html
Posted: 07 Apr 2015 at 8:16am That's a good idea. All IPC Calculator parts have the mfr. abr. at the end of the land pattern name
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2167&OB=ASC.html
://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html Turn on the new feature in Preferences > Rules > Thermal Tab Pattern Defined Solder Mask see new video: http
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063_post8485.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2063&OB=DESC.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-standard-footprints_topic2063_post8485.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063.html
. I.e. TI disco's a PN and On Semi has a replacement but the "recommended pads" or tolerancing creates a wider IPC-7351C pattern that creates a DRC if replaced and the PCB MUST remain the same for compliance reasons (UL, FCC, etc
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2063&OB=ASC.html
. I.e. TI disco's a PN and On Semi has a replacement but the "recommended pads" or tolerancing creates a wider IPC-7351C pattern that creates a DRC if replaced and the PCB MUST remain the same for compliance reasons (UL, FCC, etc
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/library-expert-2016-09-released_topic1934.html
: Updated the Land Pattern Naming Convention for 2-pin Chip, Molded Body and SOD parts to match IPC-7351C Upgraded 2-pin parts for the silkscreen to map to the real component body outline Library Editor