| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall be considered a defect, see IPC-HDBK-001 or IPC-AJ-820 handbook for guidance
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
1 |