Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson Abstract 1999 12-4 REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow Abstract 12-4 NEW GENERATION METALLIC
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