65 plating thickness results

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

of the thickness of the plating. This same condition also applies to gold cup terminals, i.e. all the gold must be removed from within the cups regardless of gold thickness

How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow

| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print

. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough

. •  Institute a one touch soldering process •  Watch the plating thickness of tin and tin/ lead coating on the boards as this can be a problem area if the coating is too thin

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

2.4.28.1D 05/04 Adhesion, Solder Resist (Mask), Tape Test Method 11 Design Criteria Examples 12 Design Criteria Examples 13 Copper Wrap Plating Thickness 14 Copper Wrap Plating Thickness 15 IPC-6012 Breakout Criteria 16 IPC-6012 Conductor Width

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_04_16_08.pdf

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/china-fab-quote/

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

Taiwan Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

Assembly Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow

| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml

. The plating thickness is too thin or the result of poor processing, which can be easily damaged during assembly; The soldering temperature is not high enough