PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_yageo-0603-resistor-solder-patterns_topic2613.xml
– L pad length = 0.90, W pad width =0.80 and S pad gap = 0.80Our conclusion: The Yageo Toe is too big for today’s assembly Potential for tombstoning The IPC Side is too big, but
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-lite-2016-13-land-pattern-naming-correct_topic1989.xml
. Same with the IPC-7351B solder joint goals. We're receiving complaints about solder joints either being too big or too small. V2017.01 will be released today and all of the default settings will be IPC-7351C
AATEC Ltd | https://aatec.ch/md-tape-n-reel-mb872.php
cylinder from the bottom Part (too high) detector / Empty pocket detector / End of tape detector – Pitch position detector User-friendly software PLC/ HMI Controller touch screen Display Adjustable parameters
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2613&OB=DESC.html
– L pad length = 0.90, W pad width = 0.80 and S pad gap = 0.80 Our conclusion: The Yageo Toe is too big for today’s assembly Potential for tombstoning The IPC Side is too big, but
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012821-medical-manufacturing-ways-to-improve-fluid-dispensing-control
. With the old method, the beads were either too thick, too thin, or overlapped, and the dots of paint were too big or too small. Sometimes the beads or dots were dragged across the surface, rendering the product unusable
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/no-silk-on-dpak_topic1242_post4873.html
, then they should be able to work with something as big as a DPAK. I suspect something in the library data is out of whack and needs some attention
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/no-silk-on-dpak_topic1242_post4880.html
, then they should be able to work with something as big as a DPAK. I suspect something in the library data is out of whack and needs some attention
