| https://www.eptac.com/instructors/
. Pritchard Hall of Fame Achievements Co-founder of IPC Designers Council Spearheaded IPC PWB Designers Certification Program Key Master Instructor in training numerous designers in CID and CID
| https://www.eptac.com/about-us/instructors
. More than forty years of experience. IPC Designer Master Instructor IPC-A-600 CIT Instructor Inducted into the IPC Raymond E. Pritchard Hall of Fame Achievements Co-founder of IPC Designers Council Spearheaded IPC PWB Designers Certification Program Key Master Instructor in training numerous designers in CID and CID
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. The LSLP reflow profile produced minimal voiding whereas the Extreme reflow profile resulted in voiding as large as 60% of the solderball diameter
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. The LSLP reflow profile produced minimal voiding whereas the Extreme reflow profile resulted in voiding as large as 60% of the solderball diameter
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
form a reliable joint with the assembly process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
process automated if volumes require. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
. Through hole paste reflow can benefit using solder bricks to increase joint volume and decrease flux residues. Some placement machine suppliers offer produced cut and form feeders, so solder wire is used, reducing the cost of simple preforms Back in the day the presenter used preforms with vapour phase and
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