Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/vacuum-demo-data.pdf
% Voids Low Void (1%) Heller Vacuum Data - DBC on Power Device DBC at Heat Sink Vacuum Parameters • Pump Rate: 250 torr/sec and 250 torr/sec (double vacuum cycle) • Dwell: 5 sec and 15 sec @ 10 torr (double vacuum cycle) Void Rate • No Vacuum: 30-40% • With Vacuum: <1% 40% Voids Low Void (<1
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? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
—User-Friendly Software with Multiple Control Points Results: DBC at Heat Sink Exhibit 7—No Vacuum vs. Vacuum on Heat Sink (<1% voids) Results: Automotive QFN Exhibit 8
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
—User-Friendly Software with Multiple Control Points Results: DBC at Heat Sink Exhibit 7—No Vacuum vs. Vacuum on Heat Sink (<1% voids) Results: Automotive QFN Exhibit 8
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
0147 PQFP Die Cracks 0148 PQFP Die Attach 0202 PBGA 3D Acoustic Microscope Image 0206 PBGA 3D Cross-Sectioned Voids in Molding Compound 0210 PBGA 3D Sectioned Voids in Molding Compound 0245 PBGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Real Time X-ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow High powered devices require electrical circuits with good thermal conductance and minimal voiding, to maintain long
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf
Heller Industries Inc.
46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf
Heller Industries Inc.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=17
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=21
. Common Process Defect Identification of QFN Packages Nordson DAGE Investigating Voids - Circuits Assembly article Nordson DAGE First
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