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. It is an ideal method for measuring glue, solder and sintered silver bonded areas. The… Testing Stent Quality with Prospector Nordson DAGE Wire pull Nordson DAGE The principle behind basic wire bond testing is positioning of a hook underneath the wire and pulling in the Z axis either
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. Wire pull Nordson DAGE The principle behind basic wire bond testing is positioning of a hook underneath the wire and pulling in the Z axis either until the bond breaks (destructive testing
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measures the tiny movements that take place over extended time periods. Wire pull Nordson DAGE The principle behind basic wire bond testing is positioning of a hook underneath the wire and pulling in the Z axis either until the bond breaks (destructive testing
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103 has many unique features including high-speed Z-axis motion for faster processing time and reduced soldering cycle. It features interchangeable solder pots compatible with tin-lead, lead-free and HMP solder alloys, and can be configured with either a single selective solder nozzle, dual selective nozzle, or a 75