Heller Industries Inc. | https://hellerindustries.com/power-electronics/
. Heller Industries has hundreds of vacuum oven systems in the field with a proven ability to reduce solder voids to <1%. Heller offers a multitude of vacuum reflow oven models suitable for all product sizes and volumes
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
joint failures from the TC1 0/100 °C thermal cycling test are shown in the optical photomicrographs in Figure 12. The large solder voids reduce the effective attachment area through which the crack propagates, thereby reducing the number of cycles to
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
joint failures from the TC1 0/100 °C thermal cycling test are shown in the optical photomicrographs in Figure 12. The large solder voids reduce the effective attachment area through which the crack propagates, thereby reducing the number of cycles to
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
joint failures from the TC1 0/100 °C thermal cycling test are shown in the optical photomicrographs in Figure 12. The large solder voids reduce the effective attachment area through which the crack propagates, thereby reducing the number of cycles to
Heller Industries Inc. | https://hellerindustries.com/environment/
), that help reduce nitrogen consumption by up to 50% versus previous 30″ Heater Modules. LOW power reduction features, like Intelligent Exhaust, have reduced electrical consumption by up to 40
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march
strength, eliminate flip-chip underfill voids and reduce package delamination Plasma Solutions for Printed Circuit Board (PCB) Manufacturing Plasma treatment cleans and desmears PCBs to enable lamination and wettability for plating through-holes, remove resin smear from PCB drilling and clean blind vias Plasma Solutions for
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] The Sethuraman investigation demonstrated that the solder void location, rather than the solder void size, is the primary mechanism by which voids can reduce solder joint integrity