Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Shatil Haque, Lumileds Lighting (Malaysia) Sdn. Bhd. "Packaging of High-Power LEDs Using Au Stud Bump Interconnects" 2004: Chrys Shea, Cookson Electronics "Optimizing Stencil Design for Lead-free SMT Processing" 2003
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: Whisker Inspection Results André M. Delhaise, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri Abstract 32-2 Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage Pradeep Lall, Kartik
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=4
. Shear testing is in accordance with: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 – Solder Ball Shear ASTM F1269 - Ball Bond Shear The position of shear tool during testing is critical for accurate and repeatable test results
Heller 公司 | https://hellerindustries.com.cn/country/france/
法国 » 法国 Heller Industries Network in France 6, rue Ampère Z.I. des Césardes SEYNOD F-74600 ANNECY Par téléphone au +33 (0)4 50 69 39 02 ou par mail à l’adresse : sales@gemaddis.com https://www.gemaddis.com/ jchen@hellerindustries.com.cn +86-21
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
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