Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Practical Guidelines in Handling Moisture Sensitivity of SMT Packages Mumtaz Bora Free! 2019 Improving Reliability of Assemblies from a Soldering Materials Development Standpoint Shantanu Joshi Free! 2019
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
- Microcracks and head-in-pillow defects as seen by high resolution X-ray inspection. X-ray / Bondtester Reliability Study of BGA Devices - Impact of Interfacial Voiding - See how X-Plane
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
-Free Soldering/Reliability Low Temperature Processing Low Volume/Prototype Non-Wet Open (NWO) Defects Package-on-Package Assembly Part Obsolescence Placement Printing Reflow Soldering/ Wave Soldering Rework and Repair of QFNs
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/application/smt
. BGA Devices Modern 2D X-ray Tackles BGA Defects - Mikrorisse und Head-in-Pillow-Defekte, wie sie bei der hochauflösenden Röntgenprüfung zu sehen sind. X-ray / Bondtester Reliability
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
. Sustainability of Dense BGA and QFP Packages in PCB Design If you are using smaller BGA and QFP packages in your designs and applications, HDI PCBs offer more reliability in transmission when your
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/dr-evstatin-krastev-from-nordson-dage-to-present-two-ground-breaking-x-ray-inspection-studies
. John Tingay, Technical Director, X-ray Products at Nordson DAGE and Dr. Krastev co-authored the paper entitled, “X-ray / Bondtester Reliability Study of BGA Devices
40731 | https://www.smta.org/harsh/2018-Harsh-Environments-Program.pdf
Surface Mount Technology Association (SMTA)
