| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinar/gold-embrittlement-when-gold-removal-is-a-must/
: When Gold Removal is a Must We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
. When do I need to remove gold plating and why do I have too? Give us a moment to explain this issue, why it is required, when it is necessary and how removal is usually performed
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
: When Gold Removal is a Must We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
| https://www.eptac.com/soldertips/gold-removal-issues-with-hollow-cup-connectors/
Gold Removal Issues with Hollow Cup Connectors | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/
Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors
Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Does this mean we should remove the ICs from their tape and reel packaging, tin the leads for proper gold removal, then re-reel the parts for proper packaging for pick and place equipment
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
