GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF10-Radial-Component-Former.pdf
• TO-92s The tooling and shuttles are easily replaced in minutes, minimizing the change-over time from one set up to another. Loose radial components with 2 or 3 leads are fed into the machine manually
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF10-Radial-Component-Former.pdf
• TO-92s The tooling and shuttles are easily replaced in minutes, minimizing the change-over time from one set up to another. Loose radial components with 2 or 3 leads are fed into the machine manually
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
note that high temperature results in much faster oxidation. In high-temperature zone, oxidation speed may increase in a linear way
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. Untrimmed Leads Untrimmed leads are leads that, because of their length, run the risk of coming into contact with other leads, creating an unwanted short circuit
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder can prevent solder powder from melting together well, thus forming tin sweats. But, this phenomenon can be controlled effectively by using proper preheat
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder can prevent solder powder from melting together well, thus forming tin sweats. But, this phenomenon can be controlled effectively by using proper preheat
| https://www.eptac.com/ask/bubbles-in-conformal-coating/
. In the process of reading your question I would consider the attached statement from the J-STD-001 document. Since the bubble is on top of the soldermask coating and if the bubble was not there would the noncommon conductors be exposed
| https://www.eptac.com/faqs/ask-helena-leo/ask/bubbles-in-conformal-coating
. In the process of reading your question I would consider the attached statement from the J-STD-001 document. Since the bubble is on top of the soldermask coating and if the bubble was not there would the noncommon conductors be exposed
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/semiconductor-packaging
. Better bonds improve heat dissipation. In addition, plasma treatment removes oxidation from the metal surface to ensure void-free die attachment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
(different from de-wetting). It is usually due to the presence of an interference layer (oxidation or contamination) on the surface to be soldered
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