| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. Can you give me some background on this issue, as we are trying to determine the root cause of... Question: We are having certain batches of PC boards exhibiting micro voiding at the copper-lead free intermetallic region after thermal stress
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. Can you give me some background on this issue, as we are trying to determine the root cause of this problem? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/training-services/on-site/
” to comply with ISO requirements Systematic focus on root cause determination and defect elimination Establishment of key performance indicators for your training program Analysis and reporting of
Blackfox Training Institute, LLC | https://www.blackfox.com/on-site-training-services/
” to comply with ISO requirements Systematic focus on root cause determination and defect elimination Establishment of key performance indicators for your training program Analysis and reporting of
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. However, this type of removal is not effective when the root cause stems from misprinted PCBs and pre-reflow solder paste issues. As a result, it is best to diagnose the cause of solder balls as early as possible, as these processes can negatively influence your PCB manufacturing and production
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/optimize-your-barrel-temperatures
. A non-optimal barrel temperature can cause a variety of process problems, such as, non-homogeneous melt, melt degradation, lower throughput, increased cooling times, undesired mechanical properties or product defects
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
What Are Reflow Soldering Defects - Heller Home » What Are Reflow Soldering Defects Reflow Soldering Defects & Causes DEFECT / CAUSE RELATIONSHIP Coplanarity Contamination Metallurgy Solder Quality Solder Volume Reflow Profile Placement Accuracy Land Design Reflow Cycle Too Long Excessive Reflow Temp
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unfortunately, there are numerous causes that can produce solder bridging. To produce as quickly and efficiently as possible, finding the root cause of this defect is critical
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-3-x-ray-inspection-system
. For root cause failure analysis applications, and to screen for smaller defects in higher quality, choose Quadra 5 and Quadra 7 . Easily ensure IPC compliance with automatic measurement and voiding analysis that gives clear pass/fail results
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