Partner Websites: sac305 ball to snagbi alloy (Page 1 of 2)

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. For instance, what is the impact of reworking a SAC305/405 assembled connector using an alternate Pb-free alloy? Is changing the Pb-free alloy used within the primary attach process to match the PTH rework alloy the right solution

Surface Mount Technology Association (SMTA)

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

., Nokia Bell Labs " Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability " 2019 3rd Place

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference

Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm

(Advanced Driver Assist Systems), reliability drivers have intensified. Karthik Vijay of Indium Corporation will present on a novel solder alloy that exceeds performance requirements as compared to SAC305 alloys

Surface Mount Technology Association (SMTA)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

, Gerald Kreindl, Markus Abstract 24-1 Pb-free Alloy Silver Content and Thermal Fatigue Reliability of a Large Plastic Ball Grid Array (PBGA) Package Richard Coyle, Heather McCormick, John Osenbach, P Abstract 2010 23-4 An Investigation Into The Development

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

’ work was one of the earliest published tin/lead solder alloy investigations to demonstrate that macro voids did not interact with the solder joint failure cracks and their presence did not cause solder joint failure. Study #2

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

’ work was one of the earliest published tin/lead solder alloy investigations to demonstrate that macro voids did not interact with the solder joint failure cracks and their presence did not cause solder joint failure. Study #2

Heller Industries Inc.

Webinars

Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/

.  Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to

Surface Mount Technology Association (SMTA)

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

.  Three surface finishes including OSP, ImAg, and ENIG are considered. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components. The assembled test boards were isothermally aged at 125oC for 12 months, which are then thermally cycled between -40oC to

Surface Mount Technology Association (SMTA)

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