| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| http://etasmt.com/cc?ID=te_news_bulletin,17761&url=_print
-quality device side must be mounted on the process first, the second side should be reflow soldered. The large mass 8 and mass devices that have been soldered at the bottom are protected to prevent the large mass devices from falling off due to secondary reflow. 5
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(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
| http://etasmt.com:9060/te_news_industry/2021-09-01/24361.chtml
(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
| http://etasmt.com/te_news_industry/2021-09-01/24361.chtml
(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
| http://etasmt.com/cc?ID=te_news_bulletin,7162&url=_print
Reflow soldering | Better work Better Life-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
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; Second, the weekly maintenance content of reflow soldering is divided into: 1. Check the transportation part of reflow soldering Check the operation of gears, bearings, drive motors, wind motors, etc. 2
| http://etasmt.com:9060/te_news_bulletin/2020-07-06/17761.chtml
-quality device side must be mounted on the process first, the second side should be reflow soldered. The large mass 8 and mass devices that have been soldered at the bottom are protected to prevent the large mass devices from falling off due to secondary reflow. 5
| http://etasmt.com/te_news_bulletin/2020-07-06/17761.chtml
-quality device side must be mounted on the process first, the second side should be reflow soldered. The large mass 8 and mass devices that have been soldered at the bottom are protected to prevent the large mass devices from falling off due to secondary reflow. 5
