Baja Bid | https://bajabid.com/global-online-auction-order-onechip-photonics-june-3-5-2014/
: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent
Baja Bid | https://bajabid.com/baja-bid-online-auction-june-3-5-2014-featuring-items-onechip-photonics-press-release-2/
. The following is a short list of the items included in this event. • Finetech Lambda Flip Chip Bonder • Averna Life Test System • Royce DE35-ST Semi-Automatic Die Handler
Baja Bid | https://bajabid.com/onechip-photonics-facility-canada-closing-assets-sold-press-release-2/
. • Finetech Lambda Flip Chip Bonder • Averna Life Test System • Royce DE35-ST Semi-Automatic Die Handler • Royce MP300 Die Sorter • Spirent SPT-2U TestCenter
Baja Bid | https://bajabid.com/auctions/page/13/?utm_source=SMTnet&utm_campaign=frymaster&utm_medium=banner&utm_content=468x60%2F
: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent
Baja Bid | https://bajabid.com/category/previous-auctions/page/8/
(Featuring Items From OneChip Photonics) Previous Auctions By BajaBid May 1, 2014 Featured Items: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent
Baja Bid | https://bajabid.com/auctions/page/12/
: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent
Baja Bid | https://bajabid.com/author/melissa/page/15/
: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=16
. Die shear testing Nordson DAGE Die/package shear testing is a high force shear test to measure the adhesion between the die and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=10
. The XM8000 fully automatic wafer inspection system provides a unique solution for inspecting bumps, TSVs, MEMs and other structures on wafer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/software?con=t
is designed for both manual and fully automatic operation. Its highly intuitive and configurable interface provides provides the ability to
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