36 sn/pb results

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. A total of six Pb-free alloys and a eutectic tin/lead (Sn-Pb) control alloy were included in the evaluation. Specifically, two binary eutectic and four ternary “near eutectic” Pb-free alloys were included. Each of the “alternative Pb-free alloys

Surface Mount Technology Association (SMTA)

. The most important phases are AuSn4 and AuSn2 intermetallic compound phases. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb or In

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454

:  Sn-Ag-Cu (SAC) solders generally have better thermal cycling performance than eutectic Sn-Pb. However, their performance deteriorates significantly as the harshness of the thermal cycle increases, and the high-Ag SAC solders that perform best in thermal cycling have relatively poor drop impact properties

Surface Mount Technology Association (SMTA)

. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix. 12 Gold Embrittlement 13 Gold Embrittlement The data presented in these figures are from a theoretical calculation and have not been tested in practice but should be useful as a guide to avoiding

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Soldering Iron Tip Temperature - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-iron-tip-temperature

. These temperatures are satisfactory for all alloys, be it either the standard Sn/Pb or the new Lead-free alloys such as SAC 305 and Sn100C