ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA) and MicroBGA often call for voiding under 20%. A low-void solder paste is required to meet the very low-voiding limits for Class 3 assemblies. UV-traceable flux
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2813&OB=ASC.html
: Various heights in an 0805 Capacitor have no impact on the land pattern. One pattern can be sufficient for all 0805 Capacitors. The IPC-J-STD-001 standard for solder joint acceptability states that the Maximum Toe value for every electronic package should not exceed 0.50 mm
Heller Industries Inc. | https://hellerindustries.com/parts/7620/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/parts/684762/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/parts/2277-2/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/parts/5833/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
Solder Dictionary of Terms | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/new-2016-solder-joint-goals_topic1921&OB=DESC_page2.html
. One pattern can be sufficient for all 0805 Capacitors. The IPC-J-STD-001 standard for solder joint acceptability states that the Maximum Toe value for every electronic package should not exceed 0.50 mm
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/new-2016-solder-joint-goals_topic1921.html
. One pattern can be sufficient for all 0805 Capacitors. The IPC-J-STD-001 standard for solder joint acceptability states that the Maximum Toe value for every electronic package should not exceed 0.50 mm
