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: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 4975 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 28 Dec 2019 at 12:56pm IPC-A-610 for PCB fabrication and IPC-J-STD-001 for assembly acceptance use 3 classes to define solder joint goal acceptability for various electronic products
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: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5188 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 28 Dec 2019 at 12:56pm IPC-A-610 for PCB fabrication and IPC-J-STD-001 for assembly acceptance use 3 classes to define solder joint goal acceptability for various electronic products
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2232&OB=DESC.html
? Posted: 28 Dec 2019 at 12:56pm IPC-A-610 for PCB fabrication and IPC-J-STD-001 for assembly acceptance use 3 classes to define solder joint goal acceptability for various electronic products. CLASS 1
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. Is the incomplete reflow of solder paste as per Section 5.2.3 of IPC-A-610 a defect requiring rework even if the fillet appears to meet IPC standards? Answer
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. Sections are shown below. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? Answer: Based upon the requirements of IPC-A-610, solder is not allowed to touch a component body
