ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/solder-paste-inspection?con=t&page=3
Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Component samples sizes for the accelerated temperature cycling test matrix. Solder Joint Void Characterization and Failure Analysis Transmission x-ray inspection and metallographic cross sectional analysis were used to characterize solder joint voiding and
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Component samples sizes for the accelerated temperature cycling test matrix. Solder Joint Void Characterization and Failure Analysis Transmission x-ray inspection and metallographic cross sectional analysis were used to characterize solder joint voiding and
| https://www.wesource.com/aoi/cyberoptics-se500-solder-paste-inspection-id-140068-3/23/
: CyberOptics SE500 Solder Paste Inspection System Model: Accurate 3-D SPI Serial Number: 60006 Notes: The SE500 provides 3-D height, volume and area measurements for PCB's with CSPS, micro-BGAs, 0201s, 01005s and other small pad sizes for which measuring solder volume is critical in verifying solder joint reliability. Vintage: Nov. 2009 Asset
| https://www.wesource.com/solder-paste-and-pcb-inspection-machines/tri-tr7006l-3d-solder-paste-inspection-machine-id-140370/
) 220V The TR7006 three-dimensional Solder Paste Inspection System tester can quickly detect the thickness of every solder joint and any open or short circuits
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. Since visual inspection is not highly effective in weeding out devices with potential solder joint issues, new technologies have emerged to help companies increase the solder joint quality of devices
| https://unisoft-cim.com/view-markup_quoting_solder-joint-count-defect-per-million-operations-dpmo-report.html
Solder Joint Count - Defect Per Million Operations (DPMO) Report | Unisoft Manufacturing Software | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
| http://etasmt.com/te_news_industry/2013-04-05/3761.chtml
. Since visual inspection is not highly effective in weeding out devices with potential solder joint issues, new technologies have emerged to help companies increase the solder joint quality of devices
| http://etasmt.com:9060/te_news_industry/2013-04-05/3761.chtml
. Since visual inspection is not highly effective in weeding out devices with potential solder joint issues, new technologies have emerged to help companies increase the solder joint quality of devices
Lewis & Clark | https://www.lewis-clark.com/product-tag/mirtec-mv7/
– Mydata Mycronic Parts – Universal Instruments UIC Pick & Place Press Reflow Oven Rework Station Router Screen Printer Selective Solder SMT Parts SPI- Solder Paste Inspection Systems Uncategorized Wave Solder X-Ray Search Products
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
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