ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/x-ray-solder-joint-inspection
X-Ray Solder Joint inspection SELECT Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Overview - All Novo 102 Novo 103 Novo 300 Novo 460 Cerno 102IL Cerno 103IL Cerno 300S Cerno 508.1 Integra 508.2 Integra 508.3 Integra 508.4 Integra
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2813&OB=ASC.html
that are out of range. Footprint Expert uses the IPC-7351 mathematical model for pad size and location calculations. But we also use IPC-J-STD-001 rules for solder joint goal acceptability
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_son-qfn-calculations_topic889.xml
; We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible.
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic889&OB=DESC.html
for high-reliability hardware. For instance, we have found several vendors that recommend a solder mask defined center pad. We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/son-qfn-calculations_topic889_post3258.html
for high-reliability hardware. For instance, we have found several vendors that recommend a solder mask defined center pad. We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic889&OB=ASC.html
for high-reliability hardware. For instance, we have found several vendors that recommend a solder mask defined center pad. We have found that when the center pad is completely surrounded by solder mask voiding in the solder joint increases and the ability to clean flux residues out from under these parts is difficult if not impossible
| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/
The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT) | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/
The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt
The Fundamentals of Solder Joint Design – Part 2 – Surface Mount Technology (SMT) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/
The Fundamentals of Solder Joint Design – Part 1 – Through Hole Technology (THT) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
