| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-iron-tip-temperature
. As for the alloy being used, the 63/37 is liquidus at 183C and the new RoHS alloys, such as SAC305 and Sn100C have a liquidus temperature around 215C
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
) in Avionics Environments" 2002: Fay Hua, Raiyo Aspandiar, Tim Rothman, Cameron Anderson, Greg Clemmons, and Mimi Klier, Intel Corporation "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste" 2001: Dr
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/automotive?page=37
) Controllers and Control Systems (19) Guns (18) Solder Paste and Soldering Systems (18) Dispense Robots (14) Melters (14) Bulk Material Delivery Systems (13
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al. Abstract 2002 15-4 IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al. Abstract 15-4 EFFECT OF
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/automotive?con=t&page=37
) Controllers and Control Systems (19) Guns (18) Solder Paste and Soldering Systems (17) Dispense Robots (14) Melters (14) Bulk Material Delivery Systems (13
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/lighting-and-led?con=t&page=37
(5) Bulk Material Delivery Systems (4) Legacy Products (3) Nozzles (3) Reservoirs and Tanks (3) Solder Paste and Soldering Systems
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
