ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/bondtesting-systems
F ully Automated Bondtesters Our automated Bondtesters remove the need for operator intervention. They can automatically test the most demanding applications such as high density solder bumps or micro-copper pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. A key technology for WLP is its interconnection layers from bare-die IO pads to solder balls: redistribution layers (RDLs). Packaging’s essential role is to interconnect between die pads with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/about-us/news/introducing-the-new-nordson-matrix-planar-ct
● XS Series Semi-Inline X-ray Inspection Systems ● XT-6 Series Offline X-ray Inspection Systems - Inspection Islands ● X1# Series ● XCT-1000 Series Applications SMT and Solder Joint Inspection Power Devices Semiconductor Final Assembly - FATP Battery Industries Automotive Consumer Electronics Energy Medical EMS Technologies 2D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/technologies/3d-planar-ct
● XS Series Semi-Inline X-ray Inspection Systems ● XT-6 Series Offline X-ray Inspection Systems - Inspection Islands ● X1# Series ● XCT-1000 Series Applications SMT and Solder Joint Inspection Power Devices Semiconductor Final Assembly - FATP Battery Industries Automotive Consumer Electronics Energy Medical EMS Technologies 2D
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/call_for_papers.cfm
. We solicit your submissions in any topical area including the following: 3D/Heterogeneous Integration Build Up/Blind & Buried Via PWBs Cu Pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials
. The increase in flip chip devices and the emergence of copper pillars and die stacking represents new challenges for the testing of these materials
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4800-bondtester
. It is a truly unique quality control tool with each feature design to accurately test semicondutor wafer interconnects such as solder balls, bumps, and copper micro pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials-software
. The increase in flip chip devices and the emergence of copper pillars and die stacking represents new challenges for the testing of these materials
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/about-us/ascend-nbs-next
Valve Systems Jetting Valve Systems Optimum Dispense Tips Optimum Syringe Barrels and Cartridges Solder Paste and TIM Two-Component Dispensing Volumetric Dispensing Nordson ELECTRONICS SOLUTIONS Back
