Heller Industries Inc. | https://hellerindustries.com/solder-shorts/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/grainy-solder/
? Reflow Soldering Problems Overview Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
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• Excessive pad size • Via in pad draining solder from interconnection Reflow-related causes: • Preheat too aggressive • Peak reflow (liquidus) temperature not being attained
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:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
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:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
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Heller Industries Inc. | https://hellerindustries.com/dull-solder-joints/
. Process and design-related causes of Dull Solder Joints: Impurity in the component plating Impurity in the circuit board finish Bad or expired solder paste Reflow-related causes of dull solder joints
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
: insufficient solder The solder joint is incomplete resulting in an open circuit or a weak interconnection. Process and design-related causes of insufficient solder
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
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