156 soldered joints results

Quality Requirements and Formation Process of Reflow Solder Joints-News-Reflow oven,SMT Reflow Solde

| http://etasmt.com:9060/te_news_bulletin/2020-09-19/19361.chtml

. Reflow solder joints first need to have good electrical conductivity. Generally speaking, a good reflow solder joint should be a metal compound formed by the mutual expansion of the solder and the surface of the metal to be soldered, rather than simply attaching the solder to it

Quality Requirements and Formation Process of Reflow Solder Joints-News-Reflow oven,SMT Reflow Solde

| http://etasmt.com/te_news_bulletin/2020-09-19/19361.chtml

. Reflow solder joints first need to have good electrical conductivity. Generally speaking, a good reflow solder joint should be a metal compound formed by the mutual expansion of the solder and the surface of the metal to be soldered, rather than simply attaching the solder to it

Quality Requirements and Formation Process of PCB Reflow Oven Joints-News-Reflow oven,SMT Reflow Sol

| http://etasmt.com/cc?ID=te_news_bulletin,18961&url=_print

. Reflow solder joints first need to have good electrical conductivity. Generally speaking, a good reflow solder joint should be a metal compound formed by the mutual expansion of the solder and the surface of the metal to be soldered, rather than simply attaching the solder to its surface

Quality Requirements and Formation Process of PCB Reflow Oven Joints-News-Reflow oven,SMT Reflow Sol

| http://etasmt.com:9060/te_news_bulletin/2020-08-25/18961.chtml

. Reflow solder joints first need to have good electrical conductivity. Generally speaking, a good reflow solder joint should be a metal compound formed by the mutual expansion of the solder and the surface of the metal to be soldered, rather than simply attaching the solder to its surface

Quality Requirements and Formation Process of PCB Reflow Oven Joints-News-Reflow oven,SMT Reflow Sol

| http://etasmt.com/te_news_bulletin/2020-08-25/18961.chtml

. Reflow solder joints first need to have good electrical conductivity. Generally speaking, a good reflow solder joint should be a metal compound formed by the mutual expansion of the solder and the surface of the metal to be soldered, rather than simply attaching the solder to its surface

Assembly – Understanding the HARD(ware) Side of IPC-A-610 - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/assembly-understanding-the-hardware-side-of-ipc-a-610

– Understanding the HARD(ware) Side of IPC-A-610 The Accept/Reject Criteria for soldered joints right? That is what IPC-A-610 "Acceptability of Electronic Assemblies" is all about. Well, yes and no

Assembly – Understanding the HARD(ware) Side of IPC-A-610 - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/assembly-understanding-the-hardware-side-of-ipc-a-610/

) Side of IPC-A-610 The Accept/Reject Criteria for soldered joints right? That is what IPC-A-610 “Acceptability of Electronic Assemblies

Webinars - EPTAC - Train. Work Smarter. Succeed (7)

| https://www.eptac.com/webinars/page/7

. Learn More Assembly – Understanding the HARD(ware) Side of IPC-A-610 Length: 40 Minutes The Accept/Reject Criteria for soldered joints right

The Need For Gold Removal On Solderable Surfaces 2 The Criteria J-STD-001 – 4.5.1 Gold Removal •  Gold Shall Be Removed: N1P2D3 –  From at least 95% of the surfaces to be soldered of the through-hole component leads with

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

[N1D2D3] be removed: a.  From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 µm [100 µin] or more of gold thickness b.  From 95

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf