| http://etasmt.com:9060/te_news_industry/2021-08-31/23361.chtml
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Non-Wetting Defect during the SMT Reflow Process From: Author: Publish time:2021-09-01 14:50 Clicks:13 Wetting issues are classified by Non-wetting and Dewetting
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. According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal. This results in the PCB pads or the
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
Profile In SMT Reflow Oven From: Author: Publish time:2021-09-01 09:38 Clicks:30 One - Profile’s importance in reflow soldering Reflow soldering is a main method to form solder joints on SMT base-panels and so is a core technology in SMT process
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
Profile In SMT Reflow Oven From: Author: Publish time:2021-09-01 09:38 Clicks:39 One - Profile’s importance in reflow soldering Reflow soldering is a main method to form solder joints on SMT base-panels and so is a core technology in SMT process
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; if it is preheated to about 150 ? , oxidation rate may be several times of that in room temperature. Please see attached figure for the relationship between copper plate temperature and oxidation speed
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/recertification.cfm
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al. Abstract 2002 15-4 IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al. Abstract 15-4 EFFECT OF
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