ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
) result in different stress distributions .The failure modes for 3 and 4 point bend testing are sensitive to both surface and edge cracks
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components
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