ORION Industries | http://orionindustries.com/pdfs/3MPR0DUCTSUMMARY.pdf
3M Product Summary Thin Bonding Adhesive Transfer Tape Click on Product to View Data Page Adhesive PRODUCT LINER Application Description ADHESION TEMP RANGE Family Caliper Type Caliper Metal HSE LSE
ORION Industries | http://orionindustries.com/pdfs/300lse.pdf
: Technical Data September, 2002 Tape 9453LE Tape 9471LE Tape 9472LE Adhesive: 3.6 mils (91 microns) 2.3 mils (58 microns) 5.2 mils (132 microns) (Solvent Free) 3M High-strength 3M High-strength 3M High-strength Acrylic Adhesive Acrylic Adhesive Acrylic Adhesive 300LSE 300LSE 300LSE Liner
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2019/08/pressurecureoven.pdf
Pressure Cure Oven (PCO) Pressure Cure Oven (PCO) System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
Heller Industries Inc. | http://hellerindustries.com/wp-content/uploads/2022/06/pressurecureoven.pdf
Pressure Cure Oven (PCO) Pressure Cure Oven (PCO) System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/pressurecureoven.pdf
Pressure Cure Oven (PCO) Pressure Cure Oven (PCO) System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
| http://etasmt.com/cc?ID=te_news_bulletin,23564&url=_print
A Pressure Curing Oven , or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/sphere-wafer-series
. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/cleaning?con=t&page=20
. Plasma cleaning technology prepares and treats surfaces in electronics manufacturing operations. If you need a corona treatment to alter the properties of a surface, you can trust our machines will consistently provide the high-frequency discharge required to improve adhesion or manage surface etching
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. Shelf Life of Tape in Roll Form 24 months from the manufacturing date when stored at 70°F (21°C) and 50% relative humidity. VI. Adhesion Retention after Immersion and Exposure (percent retention
