| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
(including the rugged Mark points),applicable for tin plating, coppering,gold plating,FPC and other types of PCB with different colors. 3. Cleaning system:dry cleaning,wet cleaning,vacuum,which can be combined to use cleaning system, a new type of wipes to ensure full contact with the steel mesh, increase the type of vacuum suction to ensure the
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
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Machine PCB Depaneling Machine PCBA Router Machine PCBA V-cutting Machine SMT Cleaning Machine PCB Cleaning Machine Ultrasonic Cleaning Machine Fixture Cleaning Machine Nozzle Cleaning Machine Squeegee
? Read Answer Failing to Remove Gold Plating in Final Assembly Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
activators. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin Mildly
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. A technician also visually inspects the PCB before passing it for lamination. Surface Finishing The surface-finishing stage involves plating the PCB with a conductive material so the manufacturer can mount electronic components during assembly
| https://www.eptac.com/solder-tips/
. We have all seen wires spliced together by twisting the two wires together forming a gentle twist before soldering. This splice would not have the physical strength of a wrap or hook splice, but it seems like it would offer at least the same strength as a lap splice with less aggravation, since the splice would
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