| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
Gold Removal on Bottom Only SMT RF Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
Solder Touching Glass Body Components Like Diodes - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
Solder Touching Glass Body Components Like Diodes - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-terminal-style-components-acceptability-for-class-3-j-std-001-and-or-ipc-a-610
SMT Terminal Style Components Acceptability for Class 3 (J-STD-001 and or IPC-A-610) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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SMT Terminal Style Components Acceptability for Class 3 (J-STD-001 and or IPC-A-610) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C
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