69 thermal shock rework repair guidelines results

] be identified, documented, and dispositioned by the Manufacturer based on the design, service, and customer requirements. •  Disposition is the determination of how defects are to be treated, and include, but are not limited to, rework, scrap, use as-is, or repair

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies

decision can be made as to whether that process can be used for the rework operation. I would also strongly recommend the use of thermal hot plates to elevate the product temperature and reduce the amount of thermal shock the board will see when exposed to the rework cycle of

Reliability of Reworked Lead-free Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/reliability-of-reworked-lead-free-assemblies/

decision can be made as to whether that process can be used for the rework operation. I would also strongly recommend the use of thermal hot plates to elevate the product temperature and reduce the amount of thermal shock the board will see when exposed to the rework cycle of

. 32 Section 14 Rework and Repair Scope This revision includes expanded coverage for the lead-free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria

| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf

. 6 What Causes Delamination  Thermal shock  Wave solder process  Manual soldering  Rework and Repair process  Moisture in the board

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_11_19_08.pdf

ACI Technologies Free Workshop Series - June 2013

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/aci-workshops-june-2013

  Underfilling with NexJet ® Hosted by ACI Technologies BGA Rework Workshop FULL - Registration CLOSED Specific workshop discussion topics include rework, repair, low-volume assembly, prototyping, screen printing for single components, flux gel deposition for BGA/CSP rework and

ASYMTEK Products | Nordson Electronics Solutions

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf

& Operator Certification Bare Board Inspection ■ IPC-A-600 Instructor & Operator Certification ■ IPC-6012 Instructor & Operator Certification Rework & Repair ■ IPC-7711

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf

& Operator Certification Bare Board Inspection ■ IPC-A-600 Instructor & Operator Certification ■ IPC-6012 Instructor & Operator Certification Rework & Repair ■ IPC-7711

Filling, Delivering and Potting | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/applications/filling-delivering-and-potting?con=t&page=25

Paste Flux Nordson EFD Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA rework, mobile device repair, reflowing solder paste, and more

ASYMTEK Products | Nordson Electronics Solutions

. If the product should become defective within the warranty period, Thermaltronics will repair or replace it free of charge at its sole option

| https://pcbasupplies.com/wp-content/uploads/2023/06/TMT-PH200_User_Manual_English.pdf