| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/thermal-compounds?con=t&page=5
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/thermal-interface-material-tim
). Two-component thermal gap filler is ideal for low-stress applications. This material is reworkable, with the two-component formulation offering less workability
Imagineering, Inc. | https://www.pcbnet.com/blog/the-importance-of-thermal-management-in-pcb-manufacturing/
% of printed circuit boards fail because of heat stress. The management of thermal loads on PCBs and their components is crucial to the longevity of the electronics they are embedded in
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
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