| http://etasmt.com:9060/te_news_industry/2021-09-01/24165.chtml
Protection Reflow Oven From: Author: Publish time:2021-09-01 09:44 Clicks:2 Lead-free era makes whether need nitrogen in reflow a hot topic
| http://etasmt.com/te_news_industry/2021-09-01/24165.chtml
Protection Reflow Oven From: Author: Publish time:2021-09-01 09:44 Clicks:2 Lead-free era makes whether need nitrogen in reflow a hot topic
| http://etasmt.com:9060/te_news_industry/2013-04-28/4161.chtml
Trade Info Company News SMT Technical Nitrogen Reflow Oven From: Author:ETA Reflow Oven Publish time:2013-04-28 22:30 Clicks:395 Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead-free solder flow resistance
| http://etasmt.com:9060/te_news_industry/2013-05-06/4361.chtml
Trade Info Company News SMT Technical Why Nitrogen Reflow Oven From: Author:www.etasmt.com Publish time:2013-05-06 18:45 Clicks:1457 Nitrogen reflow Oven Lead-free
| http://etasmt.com/te_news_industry/2013-04-28/4161.chtml
Trade Info Company News SMT Technical Nitrogen Reflow Oven From: Author:ETA Reflow Oven Publish time:2013-04-28 22:30 Clicks:385 Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead-free solder flow resistance
| http://etasmt.com/te_news_industry/2013-05-06/4361.chtml
Trade Info Company News SMT Technical Why Nitrogen Reflow Oven From: Author:www.etasmt.com Publish time:2013-05-06 18:45 Clicks:1447 Nitrogen reflow Oven Lead-free
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
activators. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. OSP (Organic Solderability Preservatives): A flat and cost-effective finish that offers good solderability for a limited time after application. VII
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin Mildly
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. However, until such time that ImAg is proven to not creep corrode, Dell will not employ this surface finish for critical business products that may be exposed to such harsh environments