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('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
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; because none of them are exact drop-in replacements for tin/lead solder, all require some process adjustments. The primary difference between most of the new formulations and traditional solder is a higher melting point
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; because none of them are exact drop-in replacements for tin/lead solder, all require some process adjustments. The primary difference between most of the new formulations and traditional solder is a higher melting point
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. Smooth without jitter. 6, inside and outside arc design: tin furnace lead-free environmental protection independent design, help the uniform flow of lead-free reflow hot air, make the process curve more perfect
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. 10, Joint Appearance: solder joint appearance should be close to the appearance of the tin / lead solder. 11, Supply capacity. 12, Compatibility with lead
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. 10, Joint Appearance: solder joint appearance should be close to the appearance of the tin / lead solder. 11, Supply capacity. 12, Compatibility with lead
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